J-STD-002CSolderabilityTest
J-STD-002C
SolderabilityTestsforComponentLeads,Terminations,Lugs,
TerminalsandWiresProposedStandardforBallot
May2007
1SCOPE
1.1ScopeThisstandardprescribestestmethods,defectdefinitions,acceptancecriteria,andillustrationsforassessingthesolderability
ofelectroniccomponentleads,terminations,solidwires,strandedwires,lugs,andtabs.Thisstandardalsoincludesatestmethodfor
theResistancetoDissolution/DewettingofMetallization.Thisstandardisintendedforusebybothvendoranduser.
1.2PurposeSolderabilityevaluationsaremadetoverifythatthesolderabilityofcomponentleadsandterminationsmeetsthe
requirementsestablishedinthisstandardandtodeterminethatstoragehashadnoadverseeffectontheabilitytosoldercomponentsto
aninterconnectingsubstrate.Determinationofsolderabilitycanbemadeatthetimeofmanufacture,atreceiptofthecomponentsby
theuser,orjustbeforeassemblyandsoldering.
Theresistancetodissolutionofmetallizationdeterminationismadetoverifythatmetallizedterminationswillremainintact
throughouttheassemblysolderingprocesses
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