SemiconductorDeviceReliabilityFailureModels
Abstract:Noabstract.
Keywords:ReliabilityModeling,FailureMechanisms,Electromigration,Corrosion,StressMigration
Authors:RichardBlish,NoelDurrant
TableofContents
Objectives,ScopeandExplanationofSymbols3
A.ELECTROMIGRATION.4
B.CORROSION.7
C.TIMEDEPENDANTDIELECTRICBREAKDOWN9
D.HOTCARRIERINJECTION12
E.SURFACEINVERSION(MobileIons).14
F.STRESSMIGRATION.16
G.TEMPERATURECYCLING&THERMALSHOCK19
H.SOFTERRORS(SingleEventUpsets).22
I.DesignofExperimentsforDeterminationofModelingParameters.24
J.Time-To-FailureDistributions.25 |