awu 发表于 2008-4-16 13:51:42

Accelerated Thermal Cycling

AcceleratedThermalCyclingandFailureMechanismsforBGAandCSPAssemblies
不錯的資料...
Introduction
Reliability,irrespectiveofitsdefinition,isnolongeran‘‘afterthe-fact’’concept;rather,itmustbeanintegralpartofdevelopmentandimplementation.Thisisspecificallytrueformicroelectronics
withdemandsforminiaturizationandsystemintegrationinafaster,better,andcheaperenvironment.BGAsandCSPsrapiddevelopmentandintroductionintothemarketisagoodexampleofthistrend.
Theuseofnewmaterials,processes,andnewapplicationsobscurethetraditionaldefinitionofqualityandreliabilityassurance.

Newsystemsapproachesareneededtoassurequalityandreliabilityaswellastomanagerisks.Qualityshouldbeassuredbydesignforreliability,controlsforprocesses,tailoredtestingmethods
forqualification,anduseofuniqueacceleratedenvironmentaltestingalongwithcredibleanalyticalprediction.Inotherwords,anefficientconcurrentengineeringsystemapproachmustbeimplemented.
EnvironmentalTesting.Amongthemanyenvironmentalacceleratedtestingmethodologiesforassessingreliabilityofelectronicsystems,thermalcyclingisthemostcommonlyusedforthe
characterizationofdevicesaswellasinterconnections.Fromthemanypredefinedthermalcyclingprofiles,themilitaryandcommercialrangesrepresentthetwoextremes.Previously,NASA
alsohadapresetspecificthermalcyclingrequirement.AlthoughanumberofMilitaryStandardswereobsoleted,theyarestillusedforbenchmarktesting.Forexample,withinMil-STD-883,there
arethreelevelsofacceleratedcyclingtemperatures

swk_sun 发表于 2008-4-28 21:28:54

谢谢很好，有关热循环的资料！

jim1 发表于 2008-4-29 20:07:21

Thankyouverymuch!!!

amyliu2009 发表于 2010-4-26 16:02:46

很有作用哦，支持下

chjhwfj 发表于 2010-4-26 21:33:00

感谢lz分享

bati21 发表于 2010-9-23 21:24:21

非常好，谢谢
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