sunjj 发表于 2014-8-1 13:21:07

求：ES59008 Data requirements for semiconductor die

ES59008Datarequirementsforsemiconductordie

Part1Generalrequirements

Part2Vocabulary

Part3Mechanical,materialandconnectivityrequirements

Part4Specificrequirementsandrecommendations
–Part4-1Testandquality
–Part4-2Handling,assemblyandstorage
–Part4-3Thermal
–Part4-4Electricalsimulation

Part5Particularrequirementsandrecommendationsfordietypes
–Part5-1Baredie
–Part5-2Barediewithaddedconnectionstructures
–Part5-3Minimally-packageddie

Part6Exchangedataformatsanddata
–Part6-1Dataexchange-DDX
–Part6-2Datadictionary

kevin_whb 发表于 2014-8-1 14:32:32

第一次看到大神求资料;P
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