manch 发表于 2011-5-29 16:01:50

加速测试模型大全

加速测试模型大全

admin 发表于 2011-5-29 23:26:52

SemiconductorDeviceReliabilityFailureModels

Abstract:Noabstract.
Keywords:ReliabilityModeling,FailureMechanisms,Electromigration,Corrosion,StressMigration
Authors:RichardBlish,NoelDurrant

TableofContents
Objectives,ScopeandExplanationofSymbols3
A.ELECTROMIGRATION.4
B.CORROSION.7
C.TIMEDEPENDANTDIELECTRICBREAKDOWN9
D.HOTCARRIERINJECTION12
E.SURFACEINVERSION(MobileIons).14
F.STRESSMIGRATION.16
G.TEMPERATURECYCLING&THERMALSHOCK19
H.SOFTERRORS(SingleEventUpsets).22
I.DesignofExperimentsforDeterminationofModelingParameters.24
J.Time-To-FailureDistributions.25

安德维京 发表于 2011-5-30 09:33:45

Abstract:Thisreviewpaperbringstogetherthemostprevalentandimportantmodelsforreliabilityfailuresinsemiconductordevices.Itgivesaexplanationofthefailure,thefailuremodel(s)andconstraintsofthemodels.Examplesarepresentedshowingtheapplicationofthemodelsforderivingaccelerationfactors.Originalreferencesareincludedforeachmodel.

帮admin老大补上abstract:)

谢谢楼主，好东东！

Allen_jje 发表于 2011-5-30 17:06:30

谢谢分享！

pif2216 发表于 2011-5-30 18:54:14

不错！

wlbvine123 发表于 2011-6-9 16:06:25

水平有限，看不懂，能不能搞点中文的上来

namixiaoxin 发表于 2011-6-18 01:38:01

好像主要是wafer级的加速度模型，这个公司的资料确实不错
谢谢楼主了

amw_2738 发表于 2011-6-18 11:37:22

不错，谢谢

77thb 发表于 2011-6-30 09:34:42

谢谢分享
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