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    Accelerated Thermal Cycling

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    AcceleratedThermalCyclingandFailureMechanismsforBGAandCSPAssemblies
    不錯的資料…
    [quote]Introduction
    Reliability,irrespectiveofitsdefinition,isnolongeran‘‘afterthe-fact’’concept;rather,itmustbeanintegralpartofdevelopmentandimplementation.Thisisspecificallytrueformicroelectronics
    withdemandsforminiaturizationandsystemintegrationinafaster,better,andcheaperenvironment.BGAsandCSPsrapiddevelopmentandintroductionintothemarketisagoodexampleofthistrend.
    Theuseofnewmaterials,processes,andnewapplicationsobscurethetraditionaldefinitionofqualityandreliabilityassurance.

    Newsystemsapproachesareneededtoassurequalityandreliabilityaswellastomanagerisks.Qualityshouldbeassuredbydesignforreliability,controlsforprocesses,tailoredtestingmethods
    forqualification,anduseofuniqueacceleratedenvironmentaltestingalongwithcredibleanalyticalprediction.Inotherwords,anefficientconcurrentengineeringsystemapproachmustbeimplemented.
    EnvironmentalTesting.Amongthemanyenvironmentalacceleratedtestingmethodologiesforassessingreliabilityofelectronicsystems,thermalcyclingisthemostcommonlyusedforthe
    characterizationofdevicesaswellasinterconnections.Fromthemanypredefinedthermalcyclingprofiles,themilitaryandcommercialrangesrepresentthetwoextremes.Previously,NASA
    alsohadapresetspecificthermalcyclingrequirement.AlthoughanumberofMilitaryStandardswereobsoleted,theyarestillusedforbenchmarktesting.Forexample,withinMil-STD-883,there
    arethreelevelsofacceleratedcyclingtemperatures[/quote]

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    Lv.4
    谢谢很好,有关热循环的资料!
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    Lv.2
    Thankyouverymuch!!!
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    很有作用哦,支持下
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    Lv.2
    感谢lz分享
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    Lv.2
    非常好,谢谢
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