AcceleratedThermalCyclingandFailureMechanismsforBGAandCSPAssemblies
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[quote]Introduction
Reliability,irrespectiveofitsdefinition,isnolongeran‘‘afterthe-fact’’concept;rather,itmustbeanintegralpartofdevelopmentandimplementation.Thisisspecificallytrueformicroelectronics
withdemandsforminiaturizationandsystemintegrationinafaster,better,andcheaperenvironment.BGAsandCSPsrapiddevelopmentandintroductionintothemarketisagoodexampleofthistrend.
Theuseofnewmaterials,processes,andnewapplicationsobscurethetraditionaldefinitionofqualityandreliabilityassurance.
Newsystemsapproachesareneededtoassurequalityandreliabilityaswellastomanagerisks.Qualityshouldbeassuredbydesignforreliability,controlsforprocesses,tailoredtestingmethods
forqualification,anduseofuniqueacceleratedenvironmentaltestingalongwithcredibleanalyticalprediction.Inotherwords,anefficientconcurrentengineeringsystemapproachmustbeimplemented.
EnvironmentalTesting.Amongthemanyenvironmentalacceleratedtestingmethodologiesforassessingreliabilityofelectronicsystems,thermalcyclingisthemostcommonlyusedforthe
characterizationofdevicesaswellasinterconnections.Fromthemanypredefinedthermalcyclingprofiles,themilitaryandcommercialrangesrepresentthetwoextremes.Previously,NASA
alsohadapresetspecificthermalcyclingrequirement.AlthoughanumberofMilitaryStandardswereobsoleted,theyarestillusedforbenchmarktesting.Forexample,withinMil-STD-883,there
arethreelevelsofacceleratedcyclingtemperatures[/quote]
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